Product Summary

Vishay FlipK FCSP05H40TR product utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections of the FCSP05H40TR are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB. This design of the FCSP05H40TR not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, bluetooth, GPS, PDAs, and portable hard disk drives where space savings and performance are crucial.

Parametrics

FCSP05H40TR absolute maximum ratings: (1)Maximum average forward current IF(AV) 50 % duty cycle at TPCB = 114 ℃, rectangular waveform: 0.5A; (2)Maximum peak one cycle A non-repetitive surge current at 25 ℃ IFSM, 5 μs sine or 3 μs rect. pulse: 190A; (3)Non-repetitive avalanche energy EAS TJ = 25 ℃, IAS = 2.0 A, L = 5.0 mH: 5 mJ; (4)Repetitive avalanche current IAR Current decaying linearly to zero in 1 μs Frequency limited by TJ maximum VA = 1.5 x VR typical: 0.5A.

Features

FCSP05H40TR features: (1)Ultra low VF to footprint area; (2)Very low profile (< 0.6 mm); (3)Low thermal resistance; (4)Supplied tested and on tape and reel.

Diagrams

FCSP05H40TR Unclamped Inductive Test Circuit

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
FCSP05H40TR
FCSP05H40TR

Vishay Semiconductors

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Data Sheet

Negotiable 
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Quantity
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Vishay Semiconductors

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Data Sheet

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Data Sheet

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Data Sheet

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